Integrated circuit packaging system with shielding and method of manufacture thereof

ABSTRACT

An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority as a Continuation of U.S. applicationSer. No. 15/091,049, filed Apr. 5, 2016, which claims the benefit under35 U.S.C. § 119(e) of U.S. Provisional Application Ser. No. 62/146,209filed Apr. 10, 2015. The entire contents of the aforementioned arehereby incorporated by reference as if fully set forth herein, under 35U.S.C. § 120. The applicant(s) hereby rescind any disclaimer of claimscope in the parent application(s) or the prosecution history thereofand advise the USPTO that the claims in this application may be broaderthan any claim in the parent application(s).

TECHNICAL FIELD

The present invention relates generally to an integrated circuitpackaging system, and more particularly to a system for packagingintegrated circuit die with electro-magnetic interference shielding.

BACKGROUND ART

Electronic products have become an integral part of our daily lives.Packages of components such as semiconductor circuits, transistors,diodes, and other electronic devices have become smaller and thinnerwith more function and connections. In packaging components, the needfor shielding components from outside electro-magnetic interference in areliable manner can influence the manufacturing processes.

The commercial demand for more function in less space can causemanufacturers to make components that are mounted extremely closetogether. The linking of electro-magnetic fields can impact the reliableoperation of these components. The requirement of providing anelectro-magnetic shield on components can add cost and reducemanufacturing yield of the components. The additional pressure of costreductions can pressure manufacturers to make compromises that canreduce the long term reliability of the integrated circuit products.

Thus, a need still remains for an integrated circuit packaging systemwith shielding that can reduce package size, support increased function,and maintain both manufacturing yield and long term reliability. In viewof the extensive commercial pressures for high volume, small size, andreliability, it is increasingly critical that answers be found to theseproblems. In view of the ever-increasing commercial competitivepressures, along with growing consumer expectations and the diminishingopportunities for meaningful product differentiation in the marketplace,it is critical that answers be found for these problems. Additionally,the need to reduce costs, improve efficiencies and performance, and meetcompetitive pressures adds an even greater urgency to the criticalnecessity for finding answers to these problems.

Solutions to these problems have been long sought but prior developmentshave not taught or suggested any solutions and, thus, solutions to theseproblems have long eluded those skilled in the art.

DISCLOSURE OF THE INVENTION

The present invention provides a method of manufacture of an integratedcircuit packaging system including: providing a substrate with internalcircuitry between a substrate top side, a substrate bottom side, andvertical sides; coupling an integrated circuit to the internalcircuitry; forming a molded package body directly on the integratedcircuit and the substrate top side of the substrate; and applying aconductive conformal shield structure directly on the molded packagebody, the vertical sides, and extending below the substrate bottom sidefor coupling the internal circuitry.

The present invention provides an integrated circuit packaging system,including: a substrate with internal circuitry between a substrate topside, a substrate bottom side, and vertical sides; an integrated circuitcoupled to the internal circuitry; a molded package body formed directlyon the integrated circuit and the substrate top side of the substrate;and a conductive conformal shield structure applied directly on themolded package body, the vertical sides, and to extend below thesubstrate bottom side coupled to the internal circuitry.

Certain embodiments of the invention have other steps or elements inaddition to or in place of those mentioned above. The steps or elementwill become apparent to those skilled in the art from a reading of thefollowing detailed description when taken with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a bottom view of a first embodiment of an integrated circuitpackaging system.

FIG. 2 is a cross-sectional view of the first embodiment of theintegrated circuit packaging system along the section line 2-2 of FIG.1.

FIG. 3 is a bottom view of an integrated circuit packaging system in asecond embodiment of the present invention.

FIG. 4 is a cross-sectional view of an integrated circuit packagingsystem in a third embodiment of the present invention.

FIG. 5 is a cross-sectional view of an integrated circuit packagingsystem in a fourth embodiment of the present invention.

FIG. 6 is a cross-sectional view of an integrated circuit packagingsystem in a fifth embodiment of the present invention.

FIG. 7 is a cross-sectional view of a masking screen of the integratedcircuit packaging system in a mask forming phase of manufacturing.

FIG. 8 is a cross-sectional view of a singulation structure of theintegrated circuit packaging system in a package sawing phase ofmanufacturing.

FIG. 9 is a cross-sectional view of a package assembly array of anintegrated circuit package assembly in an application phase ofmanufacturing.

FIG. 10 is a cross-sectional view of a physical vapor deposition (PVD)manufacturing tool of the integrated circuit packaging system.

FIG. 11 is a cross-sectional view of an integrated circuit packagingsystem in a sixth embodiment of the present invention.

FIG. 12 is a cross-sectional view of an integrated circuit packagingsystem in a seventh embodiment of the present invention.

FIG. 13 is a cross-sectional view of an integrated circuit packagingsystem in an eighth embodiment of the present invention.

FIG. 14 is a cross-sectional view of an interconnect encasing of theintegrated circuit packaging system in a system interconnect encasingphase of manufacturing.

FIG. 15 is a cross-sectional view of a singulation structure of theintegrated circuit packaging system in a package sawing phase ofmanufacturing.

FIG. 16 is a cross-sectional view of a package assembly array of anintegrated circuit package assembly in an application phase ofmanufacturing.

FIG. 17 is a flow chart of a method of manufacture of an integratedcircuit packaging system in a further embodiment of the presentinvention.

BEST MODE FOR CARRYING OUT THE INVENTION

The following embodiments are described in sufficient detail to enablethose skilled in the art to make and use the invention. It is to beunderstood that other embodiments would be evident based on the presentdisclosure, and that system, process, or mechanical changes may be madewithout departing from the scope of the present invention.

In the following description, numerous specific details are given toprovide a thorough understanding of the invention. However, it will beapparent that the invention may be practiced without these specificdetails. In order to avoid obscuring the present invention, somewell-known circuits, system configurations, and process steps are notdisclosed in detail.

The drawings showing embodiments of the system are semi-diagrammatic andnot to scale and, particularly, some of the dimensions are for theclarity of presentation and are shown exaggerated in the drawing FIGs.Similarly, although the views in the drawings for ease of descriptiongenerally show similar orientations, this depiction in the FIGs. isarbitrary for the most part. Generally, the invention can be operated inany orientation.

The same numbers are used in all the drawing FIGs. to relate to the sameelements. The embodiments have been numbered first embodiment, secondembodiment, etc. as a matter of descriptive convenience and are notintended to have any other significance or provide limitations for thepresent invention.

For expository purposes, the term “horizontal” as used herein is definedas a plane parallel to the plane or active surface of the integratedcircuit, regardless of its orientation. The term “vertical” refers to adirection perpendicular to the horizontal as just defined. Terms, suchas “above”, “below”, “bottom”, “top”, “side” (as in “sidewall”),“higher”, “lower”, “upper”, “over”, and “under”, are defined withrespect to the horizontal plane, as shown in the figures. The term “on”means there is direct physical contact between elements with nointervening elements.

The term “processing” as used herein includes deposition of material orphotoresist, patterning, exposure, development, etching, cleaning,and/or removal of the material or photoresist as required in forming adescribed structure. The term “abut” means to contact or press againstan object or structure.

Referring now to FIG. 1, therein is shown a bottom view of a firstembodiment of an integrated circuit packaging system 100. The bottomview of the first embodiment of the integrated circuit packaging system100 depicts an integrated circuit package 102 having an array of systeminterconnects 104, mounted in contact with a solder resist layer 106,and a conductive conformal shield structure 108 exposed in a peripheralregion of the integrated circuit package 102. The solder resist layer106 can be a polymer film, epoxy layer, plastic coating, or the like. Itis understood that the integrated circuit package 102 can be any type ofpackage structure, including a wafer level package (WLP), a singleintegrated circuit package, a multi-chip package, an integrated passivedevice (IPD), a package-in-package, a package-on-package, or amulti-technology package. The solder resist layer 106 can include asolder resist trench 112 along an inner perimeter 114 of a bottom side116 of the conductive conformal shield structure 108. The solder resisttrench 112 can extend continuously along the entirety of the innerperimeter 114 of the bottom side 116 of the conductive conformal shieldstructure 108. The solder resist trench 112 can be a continuous openingexposing a portion of the solder resist layer 106 around an outerperimeter 118 of the solder resist layer 106.

The conductive conformal shield structure 108 can be a conductivecoating, such as a copper, zinc, silver, tin, an alloy, or conductiveresin layer that is sprayed, plated, sputtered, printed, painted,laminated, or applied by physical vapor deposition (PVD), in contactwith the solder resist layer 106 or spaced away from it leaving asubstrate bottom layer 110 exposed. In an embodiment, the conductiveconformal shield structure 108 can be exposed on the bottom side of theintegrated circuit packaging system 100 and below the level of thesubstrate bottom layer 110.

It is understood that the number and position of the systeminterconnects 104 is an example only and the actual number and positioncan differ. By way of an example the integrated circuit packaging system100 is shown as a square shape having an equal number of columns androws of the system interconnects 104, but it is understood that thesystem interconnects 104 can form any pattern on the integrated circuitpackaging system 100. A section line 2-2 can show the position anddirection of view of the integrated circuit packaging system 100 in FIG.2.

Referring now to FIG. 2, therein is shown a cross-sectional view of thefirst embodiment of the integrated circuit packaging system 100 alongthe section line 2-2 of FIG. 1. The cross-sectional view of the firstembodiment of the integrated circuit packaging system 100 depicts theintegrated circuit package 102 having a first integrated circuit 202with an active side coupled to a substrate top side 204 by chipinterconnects 206, such as solder balls, solder bumps, stud bumps, orpillar interconnects. The first integrated circuit 202 can beelectrically coupled to internal circuitry 208 of a substrate 210. Theinternal circuitry 208 can be contact pads, filled via interconnects,system interconnect pads, routing traces, discrete component pads, or acombination thereof. The internal circuitry 208 can form aredistribution layer within the substrate 210.

A second integrated circuit 212 and a discrete component 214 can becoupled to the substrate top side 204 by the chip interconnects 206 or aconductive adhesive 216, such as solder paste, conductive epoxy,conductive tape, or the like. The discrete component 214 can be aresistor, a capacitor, inductor, voltage regulator, diode, transistor,or the like. The second integrated circuit 212 can be an integratedcircuit die, an integrated circuit package, an analog or hybrid circuit,a memory, or the like. A molded package body 218 can be formed directlyon the first integrated circuit 202, the second integrated circuit 212,the discrete component 214, and the substrate top side 204.

The solder resist layer 106 can be formed directly on the substratebottom side 110, the system interconnects 104, and the substrateinternal circuitry 208. The solder resist layer 106 can extend all theway to the edge of the substrate bottom side 110 or can be spaced awayfrom the edge leaving the substrate bottom 110 exposed.

The conductive conformal shield structure 108 can be formed directly onthe molded package body 218, vertical sides 220 of the substrate 210 andthe peripheral region of the substrate bottom side 110. The conductiveconformal shield structure 108 can electrically connect to the internalcircuitry 208 that extends to the vertical sides 220 of the substrate210 or is exposed on the substrate bottom side 110. The conductiveconformal shield structure 108 can extend below the substrate bottomside 110 and can extend horizontally below the substrate 210. Theinternal circuitry 208 can electrically connect the conductive conformalshield structure 108 to one of the system interconnects 104 thatprovides a connection to ground for the integrated circuit packagingsystem 100. The solder resist layer 106 can include the solder resisttrench 112 exposing the substrate bottom 110. The solder resist trench112 can be along an outer perimeter 222 of the substrate bottom side110. The solder resist trench 112 can be offset inward from theconductive conformal shield structure 108.

It has been discovered that the integrated circuit package 102 canprovide a thin and reliable platform for assembling multiple integratedcircuits in a single package format that is shielded from EMI. Theintegrated circuit package 102 is able to be tested prior to furtherassembly and can represent a reliable and manufacturable package formaintaining the electrical integrity of the integrated circuit packagingsystem 100.

Referring now to FIG. 3, therein is shown a bottom view of an integratedcircuit packaging system 300 in a second embodiment of the presentinvention. The bottom view of a second embodiment 300 of the integratedcircuit packaging system 100 depicts an integrated circuit package 302including the system interconnects 104 positioned in a central region ofthe integrated circuit package 302. The solder resist 106 can be appliedto the bottom of the integrated circuit package 302.

A plurality of plated through holes 304 can be aligned along eachperipheral edges of the integrated circuit package 302. The platedthrough holes 304 can have a cylindrical center portion of a platedconductive material, such as copper, silver, tin, zinc, or an alloythereof. The plurality of plated through holes 304 can each have adiameter sufficiently wide to remain after singulation, by way of anexample the diameter can be in the range of 100 to 200 um and canprovide at least 5 um after singulation. The top and bottom of theplated through holes 304 can extend beyond the cylindrical centerportion for connecting the internal circuitry 208 of FIG. 2. Theconductive conformal shield structure 108 can be formed to include theplated through holes 304.

It is understood that the position and number of the systeminterconnects 104 is an example only and the implemented number andposition of the system interconnects 104 can be different. Thepositioning of the plurality of the plated through holes 304 is anexample only, but the plurality of the plated through holes 304 will bealong the saw street of the integrated circuit package 302.

Referring now to FIG. 4, therein is shown a cross-sectional view of anintegrated circuit packaging system 400 in a third embodiment of thepresent invention. The cross-sectional view of the integrated circuitpackaging system 400 depicts the plated through holes 304 adjacent tothe vertical sides 220 of the substrate 210. The solder resist 106 cancover the substrate bottom layer 110. The conductive conformal shieldstructure 108 can be formed on the molded package body 218 and caninclude the top and bottom of the plated through holes 304 because theyare positioned directly on the saw street and present a solid conductivesurface on the vertical sides 220 of the substrate 210. The conductiveconformal shield structure 108 can include the top and bottom of theplated through holes 304 because they are electrically connected at thevertical sides 220 of the substrate 210.

The conductive conformal shield structure 108 can extend below thesubstrate bottom side 110 and make direct contact with the solder resist106. The system interconnects 104 can be coupled to the substrate bottomside 110 and in contact with the solder resist 106. A portion of theconductive conformal shield structure 108 can extend across the solderresist 106 in order to provide a capture mechanism that can preventpeeling of the conductive conformal shield structure 108. It isunderstood that the conductive conformal shield structure 108 includesthe plated through holes 304 because they are electrically connected atthe vertical sides 220 of the substrate 210.

It is understood that any of the first integrated circuit 202 of FIG. 2,the second integrated circuit 212 of FIG. 2, and the discrete component214 of FIG. 2 can be implemented in the integrated circuit packagingsystem 400. For clarity and ease of description, they are not shown.

It has been discovered that the conductive conformal shield structure108 can be formed to include the plated through holes 304 in order toincrease the electrical contacts within the conductive conformal shieldstructure 108. By increasing the number of the plated through holes 304the structural integrity of the conductive conformal shield structure108 can be increased.

Referring now to FIG. 5, therein is shown a cross-sectional view of anintegrated circuit packaging system 500 in a fourth embodiment of thepresent invention. The cross-sectional view of the integrated circuitpackaging system 500 depicts the plated through holes 304 adjacent tothe vertical sides 220 of the substrate 210. The solder resist 106 cancover the substrate bottom layer 110. The system interconnects 104 canbe coupled to the substrate bottom side 110 and in contact with thesolder resist 106. The conductive conformal shield structure 108 can beformed on the molded package body 218 and can include the plated throughholes 304 because they are positioned directly on the saw street andpresent a solid conductive surface on the vertical sides 220 of thesubstrate 210. The plurality of plated through holes 304 can each have adiameter in the range of 100 to 200 um and after singulation at least 5um will remain in place.

The conductive conformal shield structure 108 can extend below thesubstrate bottom side 110 and make direct contact with the substratebottom side 110. A portion of the conductive conformal shield structure108 can extend across the substrate bottom side 110 in order to providea capture mechanism that can prevent peeling of the conductive conformalshield structure 108. It is understood that the conductive conformalshield structure 108 includes the plated through holes 304 because theyare electrically connected at the vertical sides 220 of the substrate210.

It is understood that any of the first integrated circuit 202 of FIG. 2,the second integrated circuit 212 of FIG. 2, and the discrete component214 of FIG. 2 can be implemented in the integrated circuit packagingsystem 500. For clarity and ease of description, they are not shown.

It has been discovered that the conductive conformal shield structure108 can be formed to include the plated through holes 304 in order toincrease the electrical contacts within the conductive conformal shieldstructure 108. By increasing the number of the plated through holes 304the structural integrity of the conductive conformal shield structure108 can be increased.

Referring now to FIG. 6, therein is shown a cross-sectional view of anintegrated circuit packaging system 600 in a fifth embodiment of thepresent invention. The cross-sectional view of the integrated circuitpackaging system 600 depicts the plated through holes 304 adjacent tothe vertical sides 220 of the substrate 210. The solder resist 106 cancover the substrate bottom layer 110. The system interconnects 104 canbe coupled to the substrate bottom side 110 and in contact with thesolder resist 106. The conductive conformal shield structure 108 can beformed on the molded package body 218 and can include the plated throughholes 304 because they are positioned directly on the saw street andpresent a solid conductive surface on the vertical sides 220 of thesubstrate 210.

The conductive conformal shield structure 108 can extend below thesubstrate bottom side 110 and make direct contact with the solder resist106. A portion of the conductive conformal shield structure 108 canextend across the substrate bottom side 110 in order to provide acapture mechanism that can prevent peeling of the conductive conformalshield structure 108. It is understood that the conductive conformalshield structure 108 includes the plated through holes 304 because theyare electrically connected at the vertical sides 220 of the substrate210.

It is understood that any of the first integrated circuit 202 of FIG. 2,the second integrated circuit 212 of FIG. 2, and the discrete component214 of FIG. 2 can be implemented in the integrated circuit packagingsystem 600. For clarity and ease of description, they are not shown.

It has been discovered that the conductive conformal shield structure108 can be formed to include the plated through holes 304 in order toincrease the electrical contacts within the conductive conformal shieldstructure 108. By increasing the number of the plated through holes 304the structural integrity of the conductive conformal shield structure108 can be increased.

Referring now to FIG. 7, therein is shown a cross-sectional view of amasking screen 701 of the integrated circuit packaging system 100 in amask forming phase of manufacturing. The cross-sectional view of themasking screen 701 of the integrated circuit packaging system 100depicts a carrier 702 having a molded package strip 704 mounted thereon.The carrier 702 can be composed of metal, ceramic, plastic, fiber,glass, or the like. The molded package strip 704 can have the systeminterconnects 104 and the solder resist 106 facing away from the carrier702.

A printing screen 706 can be positioned on a wafer substrate 708. Theprinting screen 706 can be used to pattern an interconnect mask 710,such as a paste, a film, a silicone epoxy or a curable heat resistantmaterial. The printing screen 706 can block the distribution of theinterconnect mask 710 around the saw streets 712 of the molded packagestrip 704. The positioning of the printing screen 706 can allow accessof a singulation saw (not shown) over the saw streets 712 and a fixeddimension adjacent to the saw streets 712.

It has been discovered that the printing screen 706 can define thehorizontal extension dimensions of the conductive conformal shieldstructure 108 of FIG. 1 in a mass production environment. The dimensionsare predictable and repeatable.

Referring now to FIG. 8, therein is shown a cross-sectional view of asingulation structure 801 of the integrated circuit packaging system 100in a package sawing phase of manufacturing. The cross-sectional view ofthe singulation structure 801 of the integrated circuit packaging system100 depicts a singulation saw 802 having separated integrated packageassemblies 804 from the molded package strip 704 of FIG. 7.

A mask spacing 806 can establish the width of the saw street 712 of FIG.7 and a horizontal overlap distance 808, which can be greater than orequal to 10 um of horizontal spacing on the substrate bottom side 110.It is understood that some of the embodiments can eliminate the maskspacing 806 and saw directly through the interconnect mask 710. In theseembodiments, the conductive conformal shield structure 108 of FIG. 1 canabut the solder resist 106 of FIG. 1 where it extends below thesubstrate bottom side 110.

Referring now to FIG. 9, therein is shown a cross-sectional view of apackage assembly array 901 of an integrated circuit package assembly 902in an application phase of manufacturing. The cross-sectional view ofthe package assembly array 901 depicts the integrated package assemblies804 having been transferred to a deposition tape 904. The depositiontape 904 can position the integrated circuit package assembly 902 sothat the conductive conformal shield structure 108 can be formed on allof the exposed surfaces. FIG. 9 shows the integrated circuit packageassembly 902 is attached to the deposition tape 904 with theinterconnect mask 710 directly on the deposition tape 904. Thedeposition tape 904 can be a polyimide layer or other heat resistantadhesive layer for maintaining the position of the integrated packageassemblies 804 during the coating process to apply the conductiveconformal shield structure 108. It is understood that the conductiveconformal shield structure 108 can be applied by way of spraying,plating, sputtering, printing, painting, laminating, or by physicalvapor deposition (PVD).

It is understood that the vertical sides 220 of FIG. 2 of the substrate210 of FIG. 2 can have metal layers exposed by the singulation saw 802having separated the integrated package assemblies 804 from the moldedpackage strip 704 of FIG. 7. The conductive conformal shield structure108 can form a direct physical and electrical connection to the exposedportions of the vertical sides 220 or exposed portions of the substratebottom side 110. The physical and electrical connection of theconductive conformal shield structure 108 can prevent peeling or damageto the conductive conformal shield structure 108 during handling andassure a secure and quality device.

It has been discovered that the integrated circuit package assembly 902can prevent contamination of the system interconnects 104 during theapplication of the conductive conformal shield structure 108. If theconductive conformal shield structure 108 were to contaminate the systeminterconnects 104, the integrated circuit package 102 of FIG. 1 couldfail the manufacturing tests and be rejected. By implementing theintegrated circuit package assembly 902, the system interconnects 104are protected from contamination and possible short circuits.

Referring now to FIG. 10, therein is shown a cross-sectional view of aphysical vapor deposition (PVD) manufacturing tool 1001 of theintegrated circuit packaging system 100 of FIG. 1. The cross-sectionalview of the PVD manufacturing tool 1001 depicts a PVD chuck 1002supporting a PVD chip carrier 1004 having a vacuum chucking mechanism1006.

The vacuum chucking mechanism 1006 can have multiple vacuum chambers1008 with an adhesive dam 1010 mounted on its periphery. The adhesivedam 1010 can seal on the integrated circuit package 102 to form a vacuumseal. The adhesive dam 1010 is positioned to expose a periphery 1012 ofthe substrate bottom side 110 outside the vacuum chambers 1008. Thevacuum chambers 1008 can include an interconnect adhesive 1011, such asa compliant polymer with good mechanical and heat resistance. Thepressure within the vacuum chamber 1008 can be reduced prior to the PVDprocess in order to lock the integrated circuit package 102 in positionon the adhesive dam 1010. In an embodiment the vacuum chamber 1008 canbe maintained at the same pressure as the PVD chamber (not shown) inorder to avoid a pressure differential that could defeat the adhesivedam 1010.

The PVD chuck 1002 can be placed in a PVD chamber (not shown) that candeposit the conductive conformal shield structure 108 on all of theexposed surfaces of the integrated circuit package 102. The conductiveconformal shield structure 108 can be formed directly on the top of themolded package body 218, vertical sides 220 of the substrate 210, andthe periphery 1012 of the substrate bottom side 110.

It has been discovered that the physical vapor deposition (PVD)manufacturing tool 1001 can repeatedly produce the conductive conformalshield structure 108 on the integrated circuit package 102 in highvolume. By positioning the adhesive dam 1010 relative to theinterconnect adhesive 1011, the accurate dimensions of the periphery1012 can be controlled to prevent contamination to the systeminterconnects 104.

Referring now to FIG. 11, therein is shown a cross-sectional view of anintegrated circuit packaging system 1100 in a sixth embodiment of thepresent invention. The cross-sectional view of the integrated circuitpackaging system 1100 includes an integrated circuit package 1102. Theintegrated circuit package 1102 can have the first integrated circuit202 coupled to a multi-layer substrate 1104 through the chipinterconnects 206. The molded package body 218 can be formed directly onthe first integrated circuit 202, the chip interconnects 206, and themulti-layer substrate 1104.

The conductive conformal shield structure 108 can be formed on themolded package body 218, the vertical side 220, and the substrate bottomside 110. In the integrated circuit packaging system 1100, the verticalsides 220 of the multi-layer substrate 1104 have no exposed metal. Byapplying the conductive conformal shield structure 108 across thesubstrate bottom side 110 a physical and electrical connection can bemade. The system interconnects 104 can be coupled to the substratebottom side 110 and in contact with the solder resist 106. Theattachment of the conductive conformal shield structure 108 to thesubstrate bottom side 110 can prevent peeling of the conductiveconformal shield structure 108 and assure a reliable and manufacturabledevice of the integrated circuit packaging system 1100. The conductiveconformal shield structure 108 can extend across the substrate bottomside 110 greater than or equal to 10 um for making an electricalconnection.

Referring now to FIG. 12, therein is shown a cross-sectional view of anintegrated circuit packaging system 1200 in a seventh embodiment of thepresent invention. The cross-sectional view of the integrated circuitpackaging system 1200 depicts a layered substrate 1202 having a topinner layer 1204 coupled to the conductive conformal shield structure108. The solder resist 106 can cover the substrate bottom layer 110. Theconductive conformal shield structure 108 can be formed on the moldedpackage body 218 and the vertical sides 220 of the layered substrate1202 to include the top inner layer 1204 because the top inner layer1204 is positioned directly on the saw street and presents a solidconductive surface on the vertical sides 220 of the layered substrate1202.

The conductive conformal shield structure 108 can extend below thesubstrate bottom side 110 and make direct contact with the substratebottom side 110. A portion of the conductive conformal shield structure108 can extend across the substrate bottom side 110 in order to providea capture mechanism that can prevent peeling of the conductive conformalshield structure 108. It is understood that the conductive conformalshield structure 108 includes the top inner layer 1204 because it iselectrically connected at the vertical sides 220 of the layeredsubstrate 1202.

The conductive conformal shield structure 108 can contact the solderresist 106 near the vertical sides 220, where the conductive conformalshield structure 108 can extend across the substrate bottom side 110 fora distance of greater than or equal to 10 um. A solder resist trench1206 can be positioned at least 10 um from the end of the horizontalportion of the conductive conformal shield structure 108. The solderresist trench 1206 can penetrate all the way to the substrate bottomside 110 and have a width of greater than or equal to 10 um. The solderresist trench 1206 can enhance the adhesion of the adhesive dam 1010 ofFIG. 10 in order to prevent the conductive conformal shield structure108 from spreading beyond its intended coverage. The solder resisttrench 1206 can expose the substrate bottom side 110. The solder resisttrench 1206 can be along the inner perimeter 114 of the bottom side 116of the conductive conformal shield structure 108. The solder resisttrench 1206 can be offset inward from the conductive conformal shieldstructure 1206.

It is understood that any of the first integrated circuit 202 of FIG. 2,the second integrated circuit 212 of FIG. 2, and the discrete component214 of FIG. 2 can be implemented in the integrated circuit packagingsystem 1200. For clarity and ease of description, they are not shown.

It has been discovered that the conductive conformal shield structure108 can be formed to include the top inner layer 1204 in order toincrease the electrical contacts within the conductive conformal shieldstructure 108. By increasing the number of connections of the top innerlayer 1204 the structural integrity of the conductive conformal shieldstructure 108 can be increased.

Referring now to FIG. 13, therein is shown a cross-sectional view of anintegrated circuit packaging system 1300 in an eighth embodiment of thepresent invention. The cross-sectional view of the integrated circuitpackaging system 1300 depicts a layered substrate 1202 having a topinner layer 1204 coupled to the conductive conformal shield structure108. The solder resist 106 can cover the substrate bottom layer 110. Theconductive conformal shield structure 108 can be formed on the moldedpackage body 218 and the vertical sides 220 of the layered substrate1202 to include the top inner layer 1204 because the top inner layer1204 is positioned directly on the saw street and presents a solidconductive surface on the vertical sides 220 of the layered substrate1202.

The conductive conformal shield structure 108 can extend below thesubstrate bottom side 110 and make direct contact with the solder resist106. It is understood that the conductive conformal shield structure 108includes the top inner layer 1204 because it is electrically connectedat the vertical sides 220 of the layered substrate 1202. The conductiveconformal shield structure 108 can abut the solder resist 106 near thevertical sides 220, where the conductive conformal shield structure 108can extend along the substrate bottom side 110 for a distance of greaterthan 0 um.

The conductive conformal shield structure 108 can extend below thesubstrate bottom side 110 for a distance of greater than 0 um. A solderresist trench 1206 can be positioned at least 10 um from the edge of theconductive conformal shield structure 108. The solder resist trench 1206can penetrate all the way to the substrate bottom side 110 and have awidth of greater than or equal to 10 um. The solder resist trench 1206can enhance the adhesion of the adhesive dam 1010 of FIG. 10 in order toprevent the conductive conformal shield structure 108 from spreadingbeyond its intended coverage.

It is understood that any of the first integrated circuit 202 of FIG. 2,the second integrated circuit 212 of FIG. 2, and the discrete component214 of FIG. 2 can be implemented in the integrated circuit packagingsystem 1300. For clarity and ease of description, they are not shown.

It has been discovered that the conductive conformal shield structure108 can be formed to include the top inner layer 1204 in order toincrease the electrical contacts within the conductive conformal shieldstructure 108. By increasing the number of connections of the top innerlayer 1204 the structural integrity of the conductive conformal shieldstructure 108 can be increased.

Referring now to FIG. 14, therein is shown a cross-sectional view of aninterconnect encasing 1401 of the integrated circuit packaging system100 in a system interconnect encasing phase of manufacturing. Thecross-sectional view of the interconnect encasing 1401 of the integratedcircuit packaging system 100 depicts the carrier 702 having the moldedpackage strip 704 mounted thereon. The carrier 702 can be composed ofmetal, ceramic, plastic, fiber, glass, or the like. The molded packagestrip 704 can include the system interconnects 104 and the solder resist106 applied to the wafer substrate 708 facing away from the carrier 702.

An interconnect encasing layer 1402, such as a paste, a film, a siliconeepoxy or a curable heat resistant material, can be formed on the thesystem interconnects 104 and the solder resist 106 of the wafersubstrate 708. The interconnect encasing layer 1402 covers the sawstreets 712 of the molded package strip 704.

It has been discovered that the interconnect encasing layer 1402 canprovide a protection layer for the system interconnects 104 duringhandling. The interconnect encasing layer 1402 can completely encase allexposed surfaces of the system interconnects 104 and the solder resist106.

Referring now to FIG. 15, therein is shown a cross-sectional view of asingulation structure 1501 of the integrated circuit packaging system100 of FIG. 1 in a package sawing phase of manufacturing. Thecross-sectional view of the singulation structure 1501 of the integratedcircuit packaging system 100 depicts the singulation saw 802 havingseparated integrated package assemblies 804 from the molded packagestrip 704 of FIG. 7.

A saw street spacing 1502 can establish the width of the saw street 712of FIG. 7. It is understood that some of the embodiments can sawdirectly through the interconnect encasing layer 1402. In thisembodiment, the conductive conformal shield structure 108 of FIG. 1 canabut the solder resist 106 of FIG. 1 where it extends below thesubstrate bottom side 110.

Referring now to FIG. 16, therein is shown a cross-sectional view of apackage assembly array 1601 of an integrated circuit package assembly1602 in an application phase of manufacturing. The cross-sectional viewof the package assembly array 1601 depicts the integrated packageassemblies 804 having been transferred to the deposition tape 904. Thedeposition tape 904 can position the integrated circuit package assembly1602 so that the conductive conformal shield structure 108 can be formedon all of the exposed surfaces. The deposition tape 904 can be apolyimide layer or other heat resistant adhesive layer for maintainingthe position of the integrated package assemblies 804 during the coatingprocess to apply the conductive conformal shield structure 108. It isunderstood that the conductive conformal shield structure 108 can beapplied by way of spraying, plating, sputtering, printing, painting,laminating, or by physical vapor deposition (PVD).

It is understood that the vertical sides 220 of FIG. 2 of the substrate210 of FIG. 2 can have metal layers exposed by the singulation saw 802having separated the integrated package assemblies 804 from the moldedpackage strip 704 of FIG. 7. The conductive conformal shield structure108 can form a direct physical and electrical connection to the exposedportions of the vertical sides 220. The physical and electricalconnection of the conductive conformal shield structure 108 can preventpeeling or damage to the conductive conformal shield structure 108during handling and assure a secure and quality device.

It has been discovered that the integrated circuit package assembly 1602can prevent contamination of the system interconnects 104 during theapplication of the conductive conformal shield structure 108 becausethey are completely encased by the interconnect encasing layer 1402. Ifthe conductive conformal shield structure 108 were to contaminate thesystem interconnects 104, the integrated circuit package 102 of FIG. 1could fail the manufacturing tests and be rejected. By implementing theintegrated circuit package assembly 1602, the system interconnects 104are protected from contamination and possible short circuits.

Referring now to FIG. 17, therein is shown a flow chart of a method 1700of manufacture of an integrated circuit packaging system 100 in afurther embodiment of the present invention. The method 1700 includes:providing a substrate with internal circuitry between a substrate topside, a substrate bottom side, and vertical sides in a block 1702;coupling an integrated circuit to the internal circuitry in a block1704; forming a molded package body directly on the integrated circuitand the substrate top side of the substrate in a block 1706; andapplying an conductive conformal shield structure directly on the moldedpackage body, the vertical sides, and extending below the substratebottom side for coupling the internal circuitry in a block 1708.

The resulting method, process, apparatus, device, product, and/or systemis straightforward, cost-effective, uncomplicated, highly versatile andeffective, can be surprisingly and unobviously implemented by adaptingknown technologies, and are thus readily suited for efficiently andeconomically manufacturing integrated circuit packaging systems fullycompatible with conventional manufacturing methods or processes andtechnologies.

Another important aspect of the present invention is that it valuablysupports and services the historical trend of reducing costs,simplifying systems, and increasing performance.

These and other valuable aspects of the present invention consequentlyfurther the state of the technology to at least the next level.

While the invention has been described in conjunction with a specificbest mode, it is to be understood that many alternatives, modifications,and variations will be apparent to those skilled in the art in light ofthe aforegoing description. Accordingly, it is intended to embrace allsuch alternatives, modifications, and variations that fall within thescope of the included claims. All matters hitherto fore set forth hereinor shown in the accompanying drawings are to be interpreted in anillustrative and non-limiting sense.

What is claimed is:
 1. A method of manufacture of an integrated circuitpackaging system comprising: forming a molded package strip on acarrier, the molded package strip having system interconnects and asolder resist layer mounted over a wafer substrate with the wafersubstrate coupled to the system interconnects; forming an interconnectencasing on the system interconnects and the solder resist layer, theinterconnect encasing encases the system interconnects; singulating themolded package strip to form an integrated package assembly by cuttingalong a saw street of the molded package strip to expose vertical sidesof the integrated package assembly; and applying a conductive conformalshield structure directly on the integrated package assembly and theinterconnect encasing.
 2. A method of manufacture of an integratedcircuit packaging system comprising: forming a molded package strip on acarrier, the molded package strip having system interconnects and asolder resist layer mounted over a wafer substrate, the wafer substratecoupled to the system interconnects, and the system interconnects andthe solder resist layer are both facing away from the molded packagestrip; forming an interconnect encasing on the system interconnects andthe solder resist layer, the interconnect encasing encases the systeminterconnects; singulating the molded package strip to form anintegrated package assembly by cutting along a saw street of the moldedpackage strip to expose vertical sides of the integrated packageassembly; transferring the integrated package assembly to a depositiontape, the interconnect encasing positioned directly on the depositiontape; and applying a conductive conformal shield structure directly onthe integrated package assembly and the interconnect encasing.
 3. Anintegrated circuit packaging system comprising: an integrated packageassembly comprising: a molded package strip having system interconnectsand a solder resist layer mounted over a wafer substrate with the wafersubstrate coupled to the system interconnects; and an interconnectencasing on the system interconnects and the solder resist layer, theinterconnect encasing encases the system interconnects; and a conductiveconformal shield structure directly on the integrated package assembly,the interconnect encasing, and the vertical sides of the integratedpackage assembly.
 4. The method as claimed in claim 1 further comprisingforming plated through holes in the integrated package assembly andexposing the plated through holes at the vertical sides.
 5. The methodas claimed in claim 1 further comprising: forming plated through holesin the integrated package assembly; exposing the plated through holes atthe vertical sides; and electrically connecting the plated though holesto the conductive conformal shield structure between the wafer substrateand the solder resist layer.
 6. The method as claimed in claim 1 whereinapplying the conductive conformal shield structure includes electricallyconnecting the conductive conformal shield structure to an internalconductive layer.
 7. The method as claimed in claim 2 whereinsingulating the integrated package assembly includes forming platedthrough holes at a saw street and exposing the plated through holes witha singulation saw.
 8. The method as claimed in claim 2 wherein applyingthe conductive conformal shield structure includes forming theconductive conformal shield structure offset from the solder resistlayer.
 9. The system as claimed in claim 3 further comprising platedthrough holes in the integrated package assembly exposed at the verticalsides of the integrated package assembly.
 10. The system as claimed inclaim 3 further comprising plated through holes in the integratedpackage assembly exposed on the vertical sides of the integrated packageassembly and electrically coupled to the conductive conformal shieldstructure between the wafer substrate and the solder resist layer. 11.The system as claimed in claim 3 further comprising an internalconductive layer electrically connecting the conductive conformal shieldstructure.
 12. The system as claimed in claim 3 wherein the systeminterconnects and the solder resist layer are both facing away from themolded package strip.
 13. The system as claimed in claim 12 furthercomprising plated through holes having a diameter of at least 5micrometers (um) at a vertical edge of the integrated package assembly.14. The system as claimed in claim 12 further comprising plated throughholes exposed at a vertical edge of the integrated package assembly. 15.The system as claimed in claim 12 wherein the conductive conformalshield structure is offset from the solder resist layer.
 16. The methodas claimed in claim 2 wherein singulating an integrated package assemblyincludes cutting the plated through holes.